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From "materials first" to "paradigm reconstruction": China's new material industry has entered a new stage of high-quality development.
[February 1, 2026] Under the background of the acceleration of the global carbon neutral process and the intersection of a new round of scientific and technological revolution, the new material industry is undergoing a profound transformation from "functional substitution" to "system empowerment. According to the latest data from the Ministry of Industry and Information Technology, the total output value of China's new materials industry is expected to exceed 8.5 trillion billion yuan in 2025, maintaining double-digit growth for 15 consecutive years. this figure...
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From "Material First" to "Paradigm Reconstruction": China's New Material Industry Entering a New Stage of High-quality Development
[February 1, 2026] Under the background of the acceleration of the global carbon neutral process and the intersection of a new round of scientific and technological revolution, the new material industry is undergoing a profound transformation from "functional substitution" to "system empowerment. According to the latest data from the Ministry of Industry and Information Technology, the total output value of China's new materials industry is expected to exceed 8.5 trillion billion yuan in 2025, maintaining double-digit growth for 15 consecutive years. this figure...
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Solid-state battery materials break through the critical point China accelerates the construction of a full chain of independent ecology
[February 1, 2026] With the urgent demand for high-safety, high-energy density batteries for new energy vehicles, solid-state batteries are moving from a "laboratory concept" to a "first year of industrialization". According to the latest report of the China Automotive Power Battery Industry Innovation Alliance, China has made key progress in the three major solid electrolyte systems of oxides, sulfides, and polymers in 2025. Among them, oxidation...
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Semiconductor advanced packaging materials into the "card neck" new focus of domestic substitution into the tough period
[February 1, 2026] Under the background that Moore's Law is approaching the physical limit, advanced packaging (Advanced Packaging) has become the key path to continue chip performance improvement, and the material system behind it-including temporary bonding adhesive, photosensitive polyimide (PSPI), underfill adhesive (Underfill), ABF carrier...
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Semiconductor advanced packaging materials into the "stuck neck" new focus of domestic substitution into the offensive period of replication.
[February 1, 2026] Under the background that Moore's Law is approaching the physical limit, advanced packaging (Advanced Packaging) has become the key path to continue chip performance improvement, and the material system behind it-including temporary bonding adhesive, photosensitive polyimide (PSPI), underfill adhesive (Underfill), ABF carrier...
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